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INFINEON IGBT MODULE FZ1200R12KE3_S1

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INFINEON IGBT MODULE FZ1200R12KE3_S1 Specification

Connectivity Type
Module terminals, Screw type

Base Material
Insulated metal substrate

Cover Material
High-temperature plastic

Protection Level
IPM built-in protection

Rated Current
1200A

Rated Operation Voltage
1200V

Control System
Gate Driver Integrated

Features
Low-loss trench IGBT, high power density, integrated protection circuits

Components
IGBT, Diode, NTC thermistor

Cooling System
Baseplate liquid or forced air

Protection Class
Class I

Panel Type
Module

Operating Voltage
1200V

Rated Insulation Voltage
4000V (RMS)

Current Rating
1200A

Thickness
Approx. 38 mm

Way
Three-phase bridge

Product Type
IGBT Module

Material
IGBT module, insulated baseplate, silicon semiconductors

Surface Finish
Molded housing

Standard
IEC 60747-9

Surface Color
Black/White

Rated Voltage
1200V

Frequency (MHz)
DC/AC up to 20kHz switching

Maximum Output Current
1200A

Dimension (L*W*H)
190 mm x 140 mm x 38 mm

Application
Industrial motor drives, Inverters, Power supplies

IP Rating
IP20

Collector Emitter Saturation Voltage
2.5V typical at 1200A

Storage Temperature Range
-40C to +125C

Gate Emitter Voltage
20V maximum

Weight
Approx. 2 kg

Operating Junction Temperature
Up to 150C

Module Name
FZ1200R12KE3_S1

Lead Free Status
RoHS Compliant

Mounting Type
Screw Mount

Isolation Voltage
4000V AC (1 min)

About INFINEON IGBT MODULE FZ1200R12KE3_S1

Experience the fresh innovation and masterful engineering behind the INFINEON IGBT MODULE FZ1200R12KE3_S1. Engineered as a must-have for superior industrial motor drives and power supplies, this valuable module offers flawless performance and robust reliability. Designed with an insulated metal base and high-grade silicon semiconductors, it delivers a rated voltage and current of 1200V, 1200A, and premium isolation at 4000V AC. With integrated IPM protection, low-loss trench IGBT, and RoHS-compliant materials, you will find this masterpiece is ideal for high-power applications demanding efficiency and safety.

Perfect for Demanding Industrial Applications

The INFINEON IGBT MODULE FZ1200R12KE3_S1 is suitable for use in varied industrial environments, primarily tailored for motor drives, inverters, and power supply systems. Its robust mounting and insulated construction make it flawless for direct application to heatsinks or cooling plates using screw-type connectors. The modules surface is designed for optimal thermal dissipation, while control and connectivity are made easy through integrated gate driver and module terminals.

Reliable Supply and Flexible Exchange Policy

INFINEON ensures a steady supply of the FZ1200R12KE3_S1, reliably handing over modules via major global FOB ports to meet diverse project demands. Sample availability is generous, allowing customers to exchange requirements and ensure application compatibility before bulk purchase. This commitment to efficient handover and useful sample policies guarantees a seamless procurement experience for customers worldwide.

FAQs of INFINEON IGBT MODULE FZ1200R12KE3_S1:

Q: How does the FZ1200R12KE3_S1 benefit high-power industrial applications?

A: This IGBT module provides high power density, low-loss switching, and flawless integrated protection, making it valuable for industrial motor drives, inverters, and power supplies requiring stringent safety and efficiency.

Q: What is the operating temperature range and protection level of this module?

A: The operating junction temperature extends up to 150C with a storage range of -40C to +125C. It incorporates IPM built-in protection circuits and meets IP20 and Class I protection ratings.

Q: Where can the FZ1200R12KE3_S1 module be installed?

A: It is suitable for installation in industrial panels, enclosures, or directly onto cooling plates using its screw-mount base for secure and fresh integration into control cabinets or machinery.

Q: How is the module supplied and what is the sample policy?

A: INFINEON supplies these modules globally via FOB major ports. Samples are available for evaluation, ensuring seamless exchange and compatibility verification before large-scale handover.

Q: What is the usual process for integrating this module into an application?

A: Simply mount the module using screws to a heat sink, connect via module terminals, integrate control with the gate driver, and ensure proper cooling with either baseplate liquid or forced air systems.

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