Send Inquiry

Request To Call Back

BECKHOFF CX5130-0123/4GB CPU MODULE

Get a Price/Quote

MOQ : 1 Piece

BECKHOFF CX5130-0123/4GB CPU MODULE Specification

Features
Compact design, fanless, maintenance-free, modular expandable, low power consumption

Usage & Applications
Machine automation, process control, building automation

Display
No integrated display

Protection Level
IP20

Output
2 x Ethernet interfaces, 4 x USB 2.0, 1 x DVI-D, 1 x optional Multi-option interface, 1 x optional fieldbus interface

Current
Approx. 1.2 A at 24 V DC (without I/O modules)

Installation Type
DIN-rail mounting

IP Rating
IP20

Mounting Type
DIN-rail

Connectivity Type
Ethernet, USB, DVI-D, Multi-option, Fieldbus interfaces

Product Type
Embedded PC CPU Module

Operating Temperature
-25C to +60C

Working Temperature
-25C to +60C

Input
24 V DC (-15/+20%) power supply

Application
Industrial control and automation, embedded PC-based control systems

Supply Voltage
24 V DC (-15/+20%)

Dimension (L*W*H)
142 x 100 x 91 mm (without terminal block)

Weight
Approx. 900 g

Power Supply Connection
Terminal strip

Operating System
Windows Embedded Standard 7, Windows 10 IoT Enterprise or TwinCAT/BSD (optional)

Cooling
Fanless

Vibration
IEC 60068-2-6

Integrated Interfaces
2 x RJ45 Ethernet, 4 x USB 2.0, 1 x DVI-D, optional interfaces

RAM
4 GB DDR3L

Shock Resistance
IEC 60068-2-27

Expansion Modules
Modular I/O and fieldbus modules

Battery
Lithium battery for system clock

Processor
Intel Atom E3827, 1.75 GHz, Dual-Core

Real-Time Clock
Yes, battery-backed

Relative Humidity
95% (non-condensing)

Storage
CFast, microSD slot for memory expansion

About BECKHOFF CX5130-0123/4GB CPU MODULE

Unlock a marvel of automation with the BECKHOFF CX5130-0123/4GB CPU Module! This enlightened solution is engineered for champions in industrial control, delivering powerful processing with an Intel Atom E3827 Dual-Core, 4 GB DDR3L RAM, and versatile storage via CFast and microSD. Fanless, compact, and maintenance-free, it supports multiple operating systems and seamless expansion. Take advantage of unrivalled connectivity and modularity-this promotion is your chance to embrace efficiency in process control, building automation, or machine automation. Special pricing and deals available for India's innovative manufacturers and suppliers.

Versatile Applications & Innovative Features

The BECKHOFF CX5130-0123/4GB CPU Module brings excellence to a variety of surfaces of application, including machine and process automation, building control, and embedded PC-based operations. This special unit boasts fanless design, modular expandability, low power consumption, and easy DIN-rail mounting, making it ideal for modern plants seeking efficiency and robust performance. Its compact form and high reliability set a new standard for demanding industrial environments.

Payment, Supply & Delivery Information

When considering your investment outlay, we ensure competitive quotations tailored to your needs. The supply ability meets bulk and regular demands, making inventory assurance a breeze. Expect rapid arrival, with delivery time typically discussed during ordering and tailored to project urgency. Payment terms are transparent and designed for convenience, ensuring a smooth transaction process for both one-time and ongoing supply agreements across India.

FAQ's of BECKHOFF CX5130-0123/4GB CPU MODULE:

Q: How can the BECKHOFF CX5130-0123/4GB CPU Module enhance industrial automation systems?

A: By integrating high-performance dual-core processing, modular I/O support, and fanless reliability, this CPU module enables smarter, more efficient automation for machinery and plant operations.

Q: What are the key interfaces available for connectivity on this module?

A: The module offers 2 x RJ45 Ethernet ports, 4 x USB 2.0 slots, 1 x DVI-D output, and optional multi-option or fieldbus interfaces for broad application compatibility.

Q: When can I expect delivery after placing a quotation request?

A: Delivery timelines depend on your location and current inventory levels. Orders are processed promptly, with arrival details provided during the quotation or order confirmation stage.

Q: Where can the BECKHOFF CX5130-0123/4GB CPU Module be installed?

A: Designed for DIN-rail mounting, it is suitable for industrial cabinets in factories, processing plants, and building automation setups with high environmental demands.

Q: What is the process for expanding the system with additional I/O modules?

A: The CX5130-0123/4GB supports easy modular expansion-simply connect the desired Beckhoff I/O or fieldbus modules to the system's designated expansion interface for seamless integration.

Q: What are the benefits of its fanless, maintenance-free design?

A: The fanless construction reduces moving parts and dust infiltration, minimizing downtime and maintenance requirements-ideal for continuous industrial deployment under tough conditions.

Tell us about your requirement